About EMIE 2027

2027 7^th International Conference on Electronic Materials and Information Engineering (EMIE 2027) will be held in Harbin, China from July 16 to 18, 2027. Currently, a new round of technological revolution and industrial transformation is accelerating. Innovations in electronic materials—represented by semiconductors, advanced packaging, flexible electronics, next-generation displays, and quantum devices—are becoming the core engine driving the upgrading of the information industry. At the same time, emerging applications such as artificial intelligence, 6G communications, and smart sensing are placing higher demands on the performance, reliability, and manufacturability of electronic materials. The industry urgently needs to break through bottlenecks at the material source and accelerate the transition from the laboratory to the production line.

Against this backdrop, this conference will focus on cutting-edge scientific issues and the latest technological advancements in the fields of electronic materials and information engineering, and will engage in in-depth discussions on effective pathways and strategic solutions to enhance industrial competitiveness. The conference is committed to building a high-level exchange platform for scholars and industry professionals worldwide, fostering the exchange of academic ideas and the expansion of research perspectives, while also promoting the transformation of scientific research achievements and collaborative innovation in industrialization. Through a variety of formats—including keynote speeches, thematic workshops, and research exhibitions—the conference will contribute to higher-quality development in the fields of electronic materials and information engineering. We cordially invite experts, scholars, engineers, R&D personnel, and corporate representatives from universities and research institutions both domestically and internationally to attend the conference, share their latest research findings, and discuss the future direction of the industry.